Multilayer electronic component including a silicon organic compound layer arranged between layers of an external electrode

ABSTRACT

A multilayer electronic component includes a silicon (Si) organic compound layer having a body cover portion disposed in a region in which an electrode layer and a conductive resin layer are not disposed, of external surfaces of a body, and an extending portion disposed to extend from the body cover portion between a conductive resin layer and a plating layer of an external electrode, and thus, may improve bending strength and moisture resistance reliability.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is the continuation application of U.S. patentapplication Ser. No. 17/829,747 filed on Jun. 1, 2022, which is thecontinuation application of U.S. patent application Ser. No. 16/834,202filed on Mar. 30, 2020, which claims the benefit of priority to KoreanPatent Application No. 10-2019-0105820 filed on Aug. 28, 2019 in theKorean Intellectual Property Office, the entire disclosure of which isincorporated herein by reference.

TECHNICAL FIELD

The present disclosure relates to a multilayer electronic component.

BACKGROUND

A multilayer ceramic capacitor (MLCC), a type of multilayer electroniccomponent, may be a chip type capacitor mounted on the printed circuitboards of various electronic products such as imaging devices includingliquid crystal displays (LCDs), plasma display panels (PDPs), and thelike, and computers, smartphones, mobile phones, and the like, servingto charge or discharge electricity therein or therefrom.

Such multilayer ceramic capacitors may be used as components of variouselectronic devices due to their relatively small size, relatively highcapacitance, and relative ease of mounting. As various electronicdevices such as computers, mobile devices, or the like are miniaturizedand increased in terms of output, demand for miniaturization and highcapacitance of multilayer ceramic capacitors is increasing.

In addition, as recent interest in vehicle electric/electroniccomponents has increased, multilayer ceramic capacitors have also cometo require relatively high reliability and strength characteristics tobe used in vehicle or infotainment systems.

In order to secure high-reliability and high-strength characteristics, amethod of changing a conventional external electrode, including anelectrode layer, to have a double-layer structure including an electrodelayer and a conductive resin layer has been proposed. In thedouble-layer structure including the electrode layer and the conductiveresin layer, a resin composition, including a conductive material, isapplied onto the electrode layer to absorb external impacts and toprevent permeation of plating liquid. As a result, reliability may beimproved.

However, as electric vehicles, autonomous vehicles, and the like, havebeen developed in the automotive industry, a greater number ofmultilayer ceramic capacitors are required and multilayer ceramiccapacitors, used in automobiles and the like, are required to havestricter moisture resistance reliability conditions and bending strengthcharacteristics secured therein.

SUMMARY

An aspect of the present disclosure is to provide a multilayerelectronic component having improved bending strength characteristics.

An aspect of the present disclosure is to provide a multilayerelectronic component having improved moisture resistance reliability.

An aspect of the present disclosure is to provide a multilayerelectronic component having low equivalent series resistance (ESR).

However, the objects of the present disclosure are not limited to theabove, and will be more easily understood in the process of describingspecific embodiments of the present disclosure.

According to an aspect of the present disclosure, a multilayerelectronic component includes a body including dielectric layers, andfirst and second internal electrodes alternately stacked with respectivedielectric layers interposed therebetween, and having first and secondsurfaces opposing each other in a stacking direction, third and fourthsurfaces connected to the first and second surfaces and opposing eachother, and fifth and sixth surfaces connected to the first to fourthsurfaces and opposing each other, a first external electrode including afirst electrode layer connected to the first internal electrode, a firstconductive resin layer disposed on the first electrode layer, and afirst plating layer disposed on the first conductive resin layer, andeach having a first connection portion disposed on the third surface ofthe body and a first band portion extending from the first connectionportion to a portion of each of the first, second, fifth, and sixthsurfaces, a second external electrode including a second electrode layerconnected to the second internal electrode, a second conductive resinlayer disposed on the second electrode layer, and a second plating layerdisposed on the second conductive resin layer, and each having a secondconnection portion disposed on the fourth surface of the body and asecond band portion extending from the second connection portion to aportion of each of the first, second, fifth, and sixth surfaces, and asilicon (Si) organic compound layer having a body cover portion disposedon a region of external surfaces of the body between the first andsecond conductive resin layers, a first extending portion disposed toextend from the body cover portion to a region between the first bandportion of the first conductive resin layer and the first band portionof the first plating layer, and a second extending portion disposed toextend from the body cover portion to a region between the second bandportion of the second conductive resin layer and the second band portionof the second plating layer.

According to an aspect of the present disclosure, a multilayerelectronic component includes a body including dielectric layers, andfirst and second internal electrodes alternately stacked with respectivedielectric layers interposed therebetween, and having first and secondsurfaces opposing each other in a stacking direction, third and fourthsurfaces connected to the first and second surfaces and opposing eachother, and fifth and sixth surfaces connected to the first to fourthsurfaces and opposing each other, a first external electrode including afirst electrode layer connected to the first internal electrode, a firstconductive resin layer disposed on the first electrode layer, and afirst plating layer disposed on the first conductive resin layer, andeach having a first connection portion disposed on the third surface ofthe body and a first band portion extending from the first connectionportion to a portion of each of the first, second, fifth, and sixthsurfaces, a second external electrode including a second electrode layerconnected to the second internal electrode, a second conductive resinlayer disposed on the second electrode layer, and a second plating layerdisposed on the second conductive resin layer, and each having a secondconnection portion disposed on the fourth surface of the body and asecond band portion extending from the second connection portion to aportion of each of the first, second, fifth, and sixth surfaces, and asilicon (Si) organic compound layer having a body cover portion disposedon a region between the first and second conductive resin layers, afirst extending portion disposed to extend from the body cover portionto a region between the first electrode layer and the first conductiveresin layer, and a second extending portion disposed to extend from thebody cover portion to a region between the second electrode layer andthe second conductive resin layer. The first and second extendingportions have first and second openings, respectively.

According to an aspect of the present disclosure, a multilayerelectronic component includes a body including dielectric layers, andfirst and second internal electrodes alternately stacked with arespective dielectric layer interposed therebetween in a stackingdirection, the first and second internal electrodes being exposed toopposing end surfaces of the body in a length direction perpendicular tothe stacking direction, first and second external electrodes comprising:first and second electrode layers disposed on the end surfaces of thebody and connected to the first and second internal electrodes,respectively, the first and second electrode layers further extendinginwardly in the length direction along surfaces of the body that connectthe end surfaces to each other; first and second conductive resin layersto cover the first and second electrode layers, respectively; and firstand second plating layers to cover the first and second conductive resinlayers, respectively, and a silicon (Si) organic compound layer disposedto cover exterior surfaces of the body, the first and second electrodelayers, and the first and second conductive resin layers. The Si organiccompound layer has one or more first openings between the firstconductive resin layer and the first plating layer such that the firstconductive resin layer and the first plating layer are in contactthrough the one or more first openings, and has one or more secondopenings between the second conductive resin layer and the secondplating layer such that the second conductive resin layer and the secondplating layer are in contact through the one or more second openings.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment of the presentdisclosure;

FIG. 2 is a cross-sectional view taken along line I-I′ in FIG. 1 ;

FIG. 3 is a schematic exploded perspective view of a body, in whichdielectric layers and internal electrodes are stacked, according to anexemplary embodiment of the present disclosure;

FIG. 4 is an enlarged view of region P in FIG. 2 ;

FIG. 5 is a schematic perspective view of a multilayer electroniccomponent according to another exemplary embodiment of the presentdisclosure;

FIG. 6 is a cross-sectional view taken along line II-II′ in FIG. 5 ;

FIG. 7 is a schematic perspective view illustrating a modified exampleof a multilayer electronic component according to another exemplaryembodiment of the present disclosure; and

FIG. 8 is a cross-sectional view taken along line in FIG. 7 .

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be describedwith reference to specific embodiments and the accompanying drawings.However, embodiments of the present disclosure may be modified to havevarious other forms, and the scope of the present disclosure is notlimited to the embodiments described below. Further, embodiments of thepresent disclosure may be provided for a more complete description ofthe present disclosure to the ordinarily skilled artisan. Therefore,shapes and sizes of the elements in the drawings may be exaggerated forclarity of description, and the elements denoted by the same referencenumerals in the drawings may be the same elements.

In the drawings, portions not related to the description will be omittedfor clarification of the present disclosure, and a thickness may beenlarged to clearly show layers and regions. The same reference numeralswill be used to designate the same components in the same referencenumerals. Further, throughout the specification, when an element isreferred to as “comprising” or “including” an element, it means that theelement may further include other elements as well, without departingfrom the other elements, unless specifically stated otherwise.

In the drawing, an X direction may be defined as a second direction, anL direction, or a longitudinal direction, a Y direction may be definedas a third direction, a W direction, or a width direction, and a Zdirection may be defined as a first direction, a stacking direction, a Tdirection, or a thickness direction.

Multilayer Electronic Component

FIG. 1 is a schematic perspective view of a multilayer electroniccomponent according to an exemplary embodiment.

FIG. 2 is a cross-sectional view taken along line I-I′ in FIG. 1 .

FIG. 3 is a schematic exploded perspective view of a body, in whichdielectric layers and internal electrodes are stacked, according to anexemplary embodiment.

FIG. 4 is an enlarged view of region P in FIG. 2 .

Hereinafter, a multilayer electronic component 100 according to anexemplary embodiment will be described with reference to FIGS. 1 to 4 .

A multilayer electronic component 100 according to an exemplaryembodiment may include a body 110 including dielectric layers 111, andfirst and second internal electrodes 121 and 122 alternately stackedwith respective dielectric layers interposed therebetween, and havingfirst and second surfaces 1 and 2 opposing each other in a stackingdirection, third and fourth surfaces 3 and 4 connected to the first andsecond surfaces 1 and 2 and opposing each other, and fifth and sixthsurfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3, and4 and opposing each other, a first external electrode 131 including afirst electrode layer 131 a connected to the first internal electrode131, a first conductive resin layer 131 b disposed on the firstelectrode layer 131 a, a first plating layer 131 c disposed on the firstconductive resin layer 131 b, and having a first connection portion A1disposed on the third surface 3 of the body 110 and a first band portionB1 extending from the first connection portion A1 to a portion of eachof the first, second, fifth, and sixth surfaces 1, 2, 5, and 6, a secondexternal electrode 132 including a second electrode layer 132 aconnected to the second internal electrode 122, a second conductiveresin layer 132 b disposed on the second electrode layer 132 a, and asecond plating layer 132 c disposed on the second conductive resin layer132 b, and having a second connection portion A2 disposed on the fourthsurface 4 of the body 110 and a second band portion B2 extending fromthe second connection portion A2 to a portion of each of the first,second, fifth, and sixth surfaces 1, 2, 5, and 6, and a silicon (Si)organic compound layer 140 having a body cover portion 143 disposed in aregion in which the first and second electrode layers 131 a and 132 aand the first and second conductive resin layers 131 b and 132 b are notdisposed, of external surfaces of the body 110, a first extendingportion 141 disposed to extend from the body cover portion 143 betweenthe first conductive resin layer 131 b and the first plating layer 131 cof the first band portion B1, and a second extending portion 142disposed to extend from the body cover portion 143 between the secondconductive resin layer 131 b and the second plating layer 132 c of thesecond band portion B2.

In the body 110, the dielectric layers 111 and the internal electrodes121 and 122 are alternately stacked.

The body 110 is not limited in shape, but may have a hexahedral shape ora shape similar thereto. Due to shrinkage of ceramic powder particlesincluded in the body 110 during sintering, the body 110 may have asubstantially hexahedral shape rather than a hexahedral shape havingcomplete straight lines.

The body 110 may have the first and second surfaces 1 and 2 opposingeach other in a thickness direction (a Z direction), the third andfourth surfaces 3 and 4 connected to the first and second surfaces 1 and2 and opposing each other in a width direction (a Y direction), and thefifth and sixth surfaces 5 and 6 connected to the first and secondsurfaces 1 and 2 and as well as to the third and fourth surfaces 3 and 4and opposing each other in a length direction (an X direction).

The plurality of dielectric layers 111, constituting the body 110, is ina sintered state and may be integrated with each other such thatboundaries therebetween may not be readily apparent without using ascanning electron microscope (SEM).

According to an exemplary embodiment, a raw material forming thedielectric layer 111 is not limited as long as sufficient capacitancemay be obtained. For example, a barium titanate-based material, a leadcomposite perovskite-based material, a strontium titanate-basedmaterial, or the like, may be used.

Various ceramic additives, organic solvents, plasticizers, binders,dispersants, or the like may be added to the powder of barium titanate(BaTiO₃), and the like, according to the purpose of the presentdisclosure, as the material for forming the dielectric layer 111.

The body 110 may have a capacitance forming portion disposed in the body110 and including the first and second internal electrode layers 121 and122, disposed to oppose each other with the dielectric layer 111interposed therebetween, to form capacitance, and upper and lowerprotective layers 112 and 113 disposed above and below the capacitanceforming portion.

The capacitance forming portion may contribute to capacitance formationof a capacitor, and may be formed by repeatedly laminating the pluralityof first and second internal electrode layers 121 and 122 with thedielectric layer 111 interposed therebetween.

The upper protective layer 112 and the lower protective layer 113 may beformed by laminating a single dielectric layer or two or more dielectriclayers on upper and lower surfaces of the capacitance forming portion,respectively, in the vertical direction, and may basically play a rolein preventing damage to the internal electrodes due to physical orchemical stress.

The upper protective layer 112 and the lower protective layer 113 maynot include an internal electrode, and may include the same material asthe dielectric layer 111.

The plurality of internal electrodes 121 and 122 may be disposed tooppose each other with the dielectric layer 111 interposed therebetween.

The internal electrodes 121 and 122 may include first and secondinternal electrode 121 and 122 alternately disposed to oppose each otherwith respective dielectric layers interposed therebetween.

The first and second internal electrodes 121 and 122 may be exposed tothe third and fourth surfaces 3 and 4, respectively.

Referring to FIG. 2 , the first internal electrode 121 may be spacedapart from the fourth surface 4 and may be exposed through the thirdsurface 3, and the second internal electrode 122 may be spaced apartfrom the third surface 3 and may be exposed through the fourth surface4. The first external electrode 131 may be disposed on the third surface3 of the body 110 to be connected to the first internal electrode 121,and the second external electrode 132 may be disposed on the fourthsurface 4 of the body 110 to be connected to the second internalelectrode 122.

For example, the first internal electrode 121 is not connected to thesecond external electrode 132 and is connected to the first externalelectrode 131, and the second internal electrode 122 is not connected tothe first external electrode 131 and is connected to the second externalelectrode 132. Thus, the first internal electrode 121 is formed to bespaced apart from the fourth surface 4 by a predetermined distance, andthe second internal electrode 122 is formed to be spaced apart from thethird surface 3 by a predetermined distance.

The first and second internal electrodes 121 and 122 may be electricallyisolated from each other by the dielectric layer 111 disposedtherebetween.

Referring to FIG. 3 , the body 110 may be formed by alternatelylaminating the dielectric layer 111, on which the first internalelectrode 121 is printed, and the dielectric layer 111, on which thesecond internal electrode 122 is printed, in a thickness direction (a Zdirection) and sintering the dielectric layers 111 and 122.

The material forming the first and second internal electrodes 121 and122 is not limited. For example, the first and second internalelectrodes 121 and 122 may be formed using a conductive paste containinga noble metal material such as palladium (Pd), a palladium-silver(Pd-Ag) alloy, or the like, nickel (Ni), and copper (Cu).

A method of printing the conductive paste may be a screen-printingmethod, a gravure printing method, or the like, but is not limitedthereto.

The external electrodes 131 and 132 are disposed on the body 110 andinclude electrode layers 131 a and 132 a, conductive resin layers 131 band 132 b, and plating layers 131 c and 132 c.

The external electrodes 131 and 132 may include first and secondexternal electrodes 131 and 132, respectively connected to the first andsecond internal electrodes 121 and 122.

The first external electrode 131 may include a first electrode layer 131a, a first conductive resin layer 131 b, and a first plating layer 131c, and the second external electrode 132 may include a second electrodelayer 132 a, a second conductive resin layer 132 b, and a second platinglayer 132 c.

When the first external electrode 131 is divided depending on a positionin which it is disposed, the first external electrode 131 has a firstconnection portion A1, disposed on the third surface 3 of the body, anda band portion B1 extending from the first connection portion A1 to aportion of the first, second, fifth, and sixth surfaces 1, 2, and 6.

When the second external electrode 132 is divided depending on aposition in which it is disposed, the second external electrode 132 hasa second connection portion A2, disposed on the fourth surface 4 of thebody, and a band portion B2 extending from the second connection portionA2 to a portion of the first, second, fifth, and sixth surfaces 1, 2, 5,and 6.

The first and second electrode layers 131 and 132 may be formed usingany material as long as it is a material having electrical conductivitysuch as a metal or the like, and a specific material may be determinedin consideration of electrical characteristics, structural stability,and the like.

For example, the first and second electrode layers 131 and 132 mayinclude a conductive metal and glass.

A conductive metal, used for the electrode layers 131 a and 132 a, isnot limited as long as it may be electrically connected to the internalelectrode to form capacitance and may include at least one selected fromthe group consisting of, for example, copper (Cu), silver (Ag), nickel(Ni), and alloys thereof.

The electrode layers 131 a and 132 a may be formed by applying aconductive paste, prepared by adding a glass frit, to the conductivemetal powder particles and sintering the conductive paste.

When the first and second electrode layers 131 a and 132 a include aconductive metal and glass, corner portions, at which the connectionportions A1 and A2 and the band portions B1 and B2 meet, may be formedto be thin, or lifting may occur between ends of the band portions B1and B2 and the body 110. Therefore, since moisture resistancereliability may be problematic, an effect of improving the moisturereliability may be more effective when the first and second electrodelayers 131 and 132 include a conductive metal and glass.

The first and second electrode layers 131 a and 132 a may be formed bymeans of atomic layer deposition (ALD), molecular layer deposition(MLD), chemical vapor deposition (CVD) sputtering, or the like.

In addition, the first and second electrode layers 131 a and 132 a maybe formed by transferring a sheet, including a conductive metal, ontothe body 110.

The conductive resin layers 131 b and 132 b may include a conductivemetal and a base resin.

The conductive metal, included in the conductive resin layers 131 b and132 b, serves to electrically connect the conductive resin layers 131 band 132 b to the first plating layers 131 b and 132 b.

The conductive metal, included in the conductive resin layers 131 b and132 b, is not limited as long as it may be electrically connected to thefirst plating layers 131 b and 132 b and may include at least oneselected from the group consisting of, for example, copper (Cu), silver(Ag), nickel (Ni), and alloys thereof.

The conductive metal, included in the conductive resin layers 131 b and132 b, may include at least one of spherical powder particles and flakepowder particles. For example, the conductive metal may include onlyflake powder particles, or spherical powder particles, or a mixture offlake powder particles and spherical powder particles.

The spherical powder particles may have an incompletely spherical shapeand may have, for example, a shape in which a ratio of a length of amajor axis to a length of a minor axis (the major axis/the minor axis)is 1.45 or less.

The flake powder particles refer to powder particles, each having a flatand elongated shape, and is not limited to a specific shape and, forexample, a ratio of a length of a major axis and a length of a minoraxis (the major axis/the minor axis) may be 1.95 or more.

The lengths of the major axes and the minor axes of the spherical powderparticles and the flake powder particles may be measured from an imageobtained by scanning a cross section (an L-T cross section), taken froma central portion of a multilayer electronic component in a width (Y)direction, in X and Z directions with a scanning electron microscope(SEM).

The base resin, included in the conductive resin layers 131 b and 132 b,serves to secure adhesion and to absorb impact.

The base resin, included in the conductive resin layers 131 b and 132 b,is not limited as long as it has adhesion and impact absorption and ismixed with conductive metal powder particles to prepare a paste and mayinclude, for example, an epoxy-based resin.

The first and second plating layers 131 c and 132 c serve to improvemounting characteristics. In addition, when bending stress is generated,the first and second plating layers 131 c and 132 c may be peeled off toserve to prevent bending cracking.

The first plating layer 131 c may be a nickel (Ni) plating layer or atin (Sn) plating layer, and the second plating layer 132 c may also be aNi plating layer or a Sn plating layer.

First and second additional plating layers 131 d and 132 d may befurther disposed on the first and second plating layers 131 c and 132 c,respectively. In this case, the first and second plating layers 131 cand 132 c may be Ni plating layers, and the first and second additionalplating layers 131 d and 132 d may be Sn plating layers.

The first and second plating layers 131 c and 132 c may include aplurality of Ni plating layers and/or a plurality of Sn plating layers.

The Si organic compound layer 140 has a body cover portion 143 disposedin a region in which the first and second electrode layers 131 a and 132a and the first and second conductive resin layers 131 b and 132 b arenot disposed, of external surfaces of the body 110, a first extendingportion 141 disposed to extend from the body cover portion 143 betweenthe first conductive resin layer 131 b and the first plating layer 131 cof the first band portion B1, and a second extending portion 142disposed to extend from the body cover portion 143 between the secondconductive resin layer 131 b and the second plating layer 132 c of thesecond band portion B2.

The Si organic compound layer 140 serves to prevent stress, generatedwhen a substrate is deformed by thermal and physical impacts while themultilayer electronic component 100 is mounted on the substrate, frompropagating to the body 110 and to prevent cracking.

In addition, the Si organic compound layer 140 serves to improvemoisture resistance by blocking a moisture permeation path.

The base resin, included in the conductive resin layers 131 b and 132 b,also plays a role in absorbing impacts, but the role of the base resinis limited because the first conductive resin layer 131 b and the secondconductive resin layer 132 b must be disposed to be insulated.

Meanwhile, since the body cover portion 143 does not include aconductive metal and is disposed in the region in which the first andsecond electrode layers 131 a and 132 a of the external surface of thebody 110 are not disposed, the body cover portion 143 is disposed in awider region to be more effective in absorbing impact and suppressingstress propagation.

In addition, the body cover portion 143 may prevent moisture frompermeating into the body 110 through the external surface of the body100 by sealing fine pores or cracking of the body 110.

The first extending portion 141 is disposed to extend from the bodycover portion 143 between the first electrode layer 131 a and the firstconductive resin layer 131 b of the first band part B1, serving tosuppress stress propagation to the body 110 and to prevent cracking.

In addition, the first extending portion 141 serves to suppress liftingbetween an end of the first electrode layer 131 a, disposed on the firstband portion B1, and the body 110 to improve moisture resistancereliability.

The second extending portion 142 is disposed to extend from the bodycover portion 143 between the second electrode layer 132 a and thesecond conductive resin layer 132 b of the second band portion B2,serving to suppress stress propagation to the body 110 and to preventcracking.

In addition, the second extending portion 142 serves to improve moistureresistance reliability by suppressing lifting between an end of thesecond electrode layer 132 a, disposed in the second band portion B2,and the body 110.

In addition, since the extending portions 141 and 142 of the Si organiccompound layer 140 have low bonding strength with the plating layers 131c and 132 c, peel-off of the plating layers 131 c and 132 c is inducedwhen bending stress is generated. Thus, the extending portions 141 and142 may serve to prevent bending cracking.

However, when the bonding force between the extending portions 141 and142 and the plating layers 131 c and 132 c is too low, peel-off mayoccur even at low bending stress, and thus, bending cracking may not beeffectively prevented.

Accordingly, openings may be formed in the first and second extendingportions 141 and 142 such that the plating layers 131 c and 132 c arebrought into contact with the conductive resin layers 131 b and 132 bthrough the openings. Thus, predetermined bonding force may be securedto more effectively prevent bending cracking.

The Si organic compound layer 140 may be formed by forming the first andsecond electrode layers 131 a and 132 a in the body 110 includingdielectric layers and internal electrodes, forming a silicon (Si)organic compound layer 140 on an exposed external surface of the body110 and the connection portions A1 and A2 of the first and secondelectrode layers 131 a and 132 a, and removing the Si organic compoundlayer 140 formed on the connection portions A1 and A2 of the first andsecond electrode layers 131 a and 132 a.

A method of removing the organic compound layer 140 may be, for example,laser processing, mechanical polishing, dry etching, wet etching,shadowing deposition using a tape protective layer, or the like.

The Si organic compound layer 140 may include alkoxy silane.

Accordingly, the Si organic compound layer 140 has a polymeric formincluding a plurality of silicon carbide bonding structures, and hashydrophobicity.

The alkoxy silane prevents moisture permeation and contamination, andpermeates into various inorganic substrates and is then cured to protectproducts and to increase durability. In addition, the alkoxy silane mayreact with a hydroxyl group (OH), and thus, may form a strong chemicalbond to improve durability.

As compared with an epoxy resin or an inorganic compound, the epoxyresin is difficult to effectively suppress moisture permeation becauseit has no water repellent effect, a large amount of CO₂ gas may begenerated during curing to cause lifting, and the inorganic compound hasno functional group capable of reacting with a hydroxyl group whenapplied to a surface of the body 110, and thus, it is difficult toadhere to the surface of the body 110 and a chemical bond is not formed.Accordingly, it may be difficult to apply the epoxy resin or theinorganic compound to the present disclosure.

Therefore, as the Si organic compound layer 140 may include alkoxysilane, an effect of sealing fine pores or cracking may be furtherimproved and bending stress and moisture resistance reliability may befurther improved.

When a thickness of the first conductive resin layer 131 b on the firstelectrode layer 131 a of the first band portion B1 is defined as Ta anda thickness of the first extending portion 141 is defined as Tb, Tb/Tamay be 0.5 or more to 0.9 or less.

FIG. 4 is an enlarged view of region P in FIG. 2 . Referring to FIG. 4 ,thicknesses of the first conductive resin layer 131 b and the firstextending portion 141 on the first electrode layer 131 a of the firstband portion B1 will be described in detail. However, the above detaileddescription may be identically applied to thicknesses of the secondconductive resin layer 132 b and the second extending portion 142 on thesecond electrode layer 132 a of the second band portion B2.

After preparing sample chips while changing the ratio of the thicknessTb of the first extending portion 141 to the thickness Ta of the firstconductive resin layer 131 b on the first electrode layer 131 a of thefirst band portion B1 (Tb/Ta), bending strength and equivalent seriesresistance (ESR) were evaluated, and the results are shown in Tables 1and 2, respectively.

The bending strength was measured using a bending strength measuringmethod through a piezoelectric effect. After mounting samples of amultilayer ceramic capacitor on a substrate, a distance from a centralportion pressed during bending was set to be 6 mm to observe whethercracking occurred in the sample chips. The number of sample chips, inwhich cracking occurred, to the total number of sample chips is shown.

According to the ESR evaluation, a sample chip was maintained at atemperature of −55° C. for 30 minutes and increased to a temperature of125° C. and was then maintained for 30 minutes, one cycle. After 500cycles were applied, a sample having ESR greater than 50mΩ wasdetermined to be defective. The number of sample chips having defectiveESR to the total number of sample chips was shown.

TABLE 1 Bending Strength Evaluation No. Tb/Ta A Lot B Lot C Lot D Lot ELot Sum 1 0.3 0/60 2/60 1/60 2/60 0/60 3/300 2 0.5 0/60 0/60 0/60 0/600/60 0/300 3 0.7 0/60 0/60 0/60 0/60 0/60 0/300 4 0.9 0/60 0/60 0/600/60 0/60 0/300 5 1.1 0/60 0/60 0/60 0/60 0/60 0/300 6 1.3 0/60 0/600/60 0/60 0/60 0/300

Referring to Table 1, in Test No. 1 in which Tb/Ta was 0.3, crackingoccurred in three sample chips among a total of 300 sample chips.

On the other hand, in Test Nos. 2 to 6 in which Tb/Ta was 0.5 or more,there was no sample chip in which cracking occurred. Accordingly,bending strength was excellent.

TABLE 2 ESR Evaluation No. Tb/Ta A Lot B Lot C Lot D Lot E Lot Sum 1 0.30/320 0/320 0/320 0/320 0/320  0/1600 2 0.5 0/320 0/320 0/320 0/3200/320  0/1600 3 0.7 0/320 0/320 0/320 0/320 0/320  0/1600 4 0.9 0/3200/320 0/320 0/320 0/320  0/1600 5 1.1 0/320 0/320 5/320 0/320 0/320 5/1600 6 1.3 0/320 7/320 2/320 3/320 0/320 12/1600

Referring to Table 2, in Test No. 5 in which Tb/Ta was 1.1, an ESRdefect occurred in five sample chips among a total of 1600 sample chips.In Test No. 6 in which Tb/Ta was 1.3, an ESR defect occurred in twelvesample chips among a total of 1600 sample chips.

On the other hand, In Test Nos. 1 to 4 in which Tb/Ta was 0.9 or less,there was no sample chip in which an ESR defect occurred. Accordingly,ESR characteristics were excellent.

Therefore, to secure excellent ESR characteristics while improvingbending strength, the ratio of the thickness Tb of the first extendingportion 141 to the thickness Ta of the first conductive resin layer 131b on the first electrode layer 131 a of the first band portion B1(Tb/Ta) may be, in detail, 0.5 or more to 0.9 or less.

FIG. 5 is a schematic perspective view of a multilayer electroniccomponent according to another exemplary embodiment.

FIG. 6 is a cross-sectional view taken along line II-II′ in FIG. 5 .

FIG. 7 is a schematic perspective view illustrating a modified exampleof a multilayer electronic component according to another exemplaryembodiment.

FIG. 8 is a cross-sectional view taken along line in FIG. 7 .

Hereinafter, a multilayer electronic component 100′ according to anotherexemplary embodiment and a modified example 100″ thereof will bedescribed with reference to FIGS. 5 to 8 . However, descriptions commonto the multilayer electronic component 100 according to the embodimentwill be omitted to avoid duplicate descriptions.

A multilayer electronic component 100′ according to an exemplaryembodiment may include a body 110 including dielectric layers 111, andfirst and second internal electrodes 121 and 122 alternately stackedwith respective dielectric layers interposed therebetween, and havingfirst and second surfaces 1 and 2 opposing each other in a stackingdirection, third and fourth surfaces 3 and 4 connected to the first andsecond surfaces 1 and 2 and opposing each other, and fifth and sixthsurfaces 5 and 6 connected to the first to fourth surfaces 1, 2, 3, and4 and opposing each other, a first external electrode 131 including afirst electrode layer 131 a connected to the first internal electrode131, a first conductive resin layer 131 b disposed on the firstelectrode layer 131 a, a first plating layer 131 c disposed on the firstconductive resin layer 131 b, and having a first connection portion A1disposed on the third surface 3 of the body 110 and a first band portionB1 extending from the first connection portion A1 to a portion of eachof the first, second, fifth, and sixth surfaces 1, 2, 5, and 6, a secondexternal electrode 132 including a second electrode layer 132 aconnected to the second internal electrode 122, a second conductiveresin layer 132 b disposed on the second electrode layer 122, and asecond plating layer 132 c disposed on the second conductive resin layer132 b, and having a second connection portion A2 disposed on the fourthsurface 4 of the body 110 and a second band portion B2 extending fromthe second connection portion A2 to a portion of each of the first,second, fifth, and sixth surfaces 1, 2, 5, and 6, and a silicon (Si)organic compound layer 140′ having a body cover portion 143 disposed ina region in which the first and second electrode layers 131 a and 132 aand the first and second conductive resin layers 131 b and 132 b are notdisposed, of external surfaces of the body 110, a first extendingportion 141′ disposed to extend from the body cover portion 143 betweenthe first electrode layer 131 a and the first conductive resin layer 131b and a second extending portion 142′ disposed to extend from the bodycover portion 143 between the second electrode layer 132 a and thesecond conductive resin layer 132 b. The first and second extendingportions 141′ and 142′ may have first and second openings H1 and H2,respectively.

The first conductive resin layer 131 b may be in contact with the firstelectrode layer 131 a through the first opening H1, and the secondconductive resin layer 132 b may be in contact with the second electrodelayer 132 a through the second opening H2. For example, the firstopening H1 may be filled with the first plating layer 131 c, and thesecond opening H2 may be filled with the second plating layer 132 c.

The Si organic compound layer 140′ may be formed by forming the firstand second electrode layers 131 a and 132 a in the body 110 includingdielectric layers and internal electrodes, forming a silicon (Si)organic compound layer on an exposed external surface of the body 110and the first and second electrode layers 131 a and 132 a, and removinga portion of the Si organic compound layer formed on the first andsecond electrode layers 131 a and 132 a to form the first and secondopenings H1 and H2.

A method of removing a region in which the openings H1 and H2 to beformed, may be, for example, laser processing, mechanical polishing, dryetching, wet etching, shadowing deposition using a tape protectivelayer, or the like.

In this case, an area of the first opening H1 may be 20 to 90% of anarea of the first extending portion 141′, an area of the second openingH2 may be 20 to 90% of an area of the second extending portion 142′.

When the area of the first opening H1 is less than 20% of the area ofthe first extending portion 141′, electrical connectivity between thefirst electrode layer 131 a and the first conductive resin layer 131 bis deteriorated to increase ESR. On the other hand, when the area of thefirst opening H1 is greater than 90% of the area of the first extendingportion 141′, an effect of improving bending strength and moistureresistance reliability of the Si organic compound layer 140′ may beinsufficient.

The first opening H1 may be disposed in one or more of the first bandportion B1 and the first connection portion A1 of the first electrodelayer, and the second opening H2 may be disposed in one or more of thesecond band portion B2 and the second connection portion A2.

As illustrated in FIG. 6 , the first connecting portion 141′ may have aform in which the first opening portion H1 is only disposed in the firstconnecting portion A1, and the second connecting portion 142′ may have aform in which a second opening portion H2 is only disposed in the secondconnection portion A2.

In addition, as illustrated in FIG. 8 , the first connection portion141″ may have a form in which the first opening portion H1 is disposedin both the first connection portion A1 and the first band portion B1,and the second connection portion 142″ may have a form in which thesecond opening H2 is disposed in both the second connection portion A2and the second band portion B2.

The shape and the number of the openings H1 and H2 are not limited, andeach of the openings H1 and H2 may have a shape such as a circle, arectangle, an ellipse, a rectangle having rounded corners, and the like,and may have an irregular shape.

As described above, a multilayer electronic component may include asilicon (Si) organic compound layer having a body cover portion disposedin a region in which an electrode layer and a conductive resin layer arenot disposed, of external surfaces of a body, and an extending portiondisposed to extend from the body cover portion between the conductiveresin layer and a plating layer of an external electrode, and thus, mayimprove bending strength.

In addition, the Si organic compound layer may be provided to improvemoisture resistance reliability.

While embodiments have been shown and described above, it will beapparent to those skilled in the art that modifications and variationscould be made without departing from the scope of the present disclosureas defined by the appended claims.

What is claimed is:
 1. A multilayer electronic component comprising: abody including dielectric layers, and first and second internalelectrodes alternately stacked with respective dielectric layersinterposed therebetween, the body having first and second surfacesopposing each other in a stacking direction, third and fourth surfacesconnected to the first and second surfaces and opposing each other, andfifth and sixth surfaces connected to the first to fourth surfaces andopposing each other; a first external electrode including a firstelectrode layer connected to the first internal electrode, a firstconductive resin layer disposed on the first electrode layer, and afirst plating layer disposed on the first conductive resin layer, andeach having a first connection portion disposed on the third surface ofthe body and a first band portion extending from the first connectionportion to a portion of each of the first, second, fifth, and sixthsurfaces; a second external electrode including a second electrode layerconnected to the second internal electrode, a second conductive resinlayer disposed on the second electrode layer, and a second plating layerdisposed on the second conductive resin layer, and each having a secondconnection portion disposed on the fourth surface of the body and asecond band portion extending from the second connection portion to aportion of each of the first, second, fifth, and sixth surfaces; and asilicon (Si) organic compound layer having a body cover portion disposedon a region of external surfaces of the body between the first andsecond conductive resin layers, a first extending portion disposed toextend from the body cover portion to a region between the first bandportion of the first conductive resin layer and the first band portionof the first plating layer, and a second extending portion disposed toextend from the body cover portion to a region between the second bandportion of the second conductive resin layer and the second band portionof the second plating layer, wherein the first and second conductiveresin layers include a conductive metal and a base resin, wherein atleast one of the first or second extending portions has an openingthrough which the first plating layer contacts the first conductiveresin layer or the second plating layer contacts the second conductiveresin layer, respectively, and wherein the first plating layer and thesecond plating layer are not in direct contact with the body.
 2. Themultilayer electronic component of claim 1, wherein the Si organiccompound layer includes alkoxy silane.
 3. The multilayer electroniccomponent of claim 2, wherein Tb/Ta is 0.5 or more and 0.9 or less,where a thickness of the first conductive resin layer on the first bandportion of the first electrode layer is defined as ‘Ta’ and a thicknessof the first extending portion is defined as ‘Tb’.
 4. The multilayerelectronic component of claim 1, wherein the first and second electrodelayers include a conductive metal and glass.
 5. The multilayerelectronic component of claim 1, further comprising: first and secondadditional plating layers disposed on the first and second platinglayers, respectively.
 6. The multilayer electronic component of claim 1,wherein the body cover portion is disposed on the external surfaces ofthe body on which the first and second electrode layers and the firstand second conductive resin layers are not disposed.
 7. The multilayerelectronic component of claim 1, wherein the first extending portionextends only between the first band portion of the first conductiveresin layer and the first band portion of the first plating layer, andwherein the second extending portion extends only between the secondband portion of the second conductive resin layer and the second bandportion of the second plating layer.
 8. A multilayer electroniccomponent comprising: a body including dielectric layers, and first andsecond internal electrodes alternately stacked with respectivedielectric layers interposed therebetween, the body having first andsecond surfaces opposing each other in a stacking direction, third andfourth surfaces connected to the first and second surfaces and opposingeach other, and fifth and sixth surfaces connected to the first tofourth surfaces and opposing each other; a first external electrodeincluding a first electrode layer connected to the first internalelectrode, a first conductive resin layer disposed on the firstelectrode layer, and a first plating layer disposed on the firstconductive resin layer, and each having a first connection portiondisposed on the third surface of the body and a first band portionextending from the first connection portion to a portion of each of thefirst, second, fifth, and sixth surfaces; a second external electrodeincluding a second electrode layer connected to the second internalelectrode, a second conductive resin layer disposed on the secondelectrode layer, and a second plating layer disposed on the secondconductive resin layer, and each having a second connection portiondisposed on the fourth surface of the body and a second band portionextending from the second connection portion to a portion of each of thefirst, second, fifth, and sixth surfaces; and a silicon (Si) organiccompound layer having a body cover portion disposed on a region ofexternal surfaces of the body between the first and second conductiveresin layers, a first extending portion disposed to extend from the bodycover portion to a region between the first conductive resin layer andthe first plating layer, and a second extending portion disposed toextend from the body cover portion to a region between the secondconductive resin layer and the second plating layer, wherein the firstand second extending portions have plural first and second openings,respectively, wherein the plural first openings are disposed in at leastone of the first band portion or the first connection portion, whereinthe plural second openings are disposed in at least one of the secondband portion or the second connection portion, and wherein the firstplating layer and the second plating layer are not in direct contactwith the body.
 9. The multilayer electronic component of claim 8,wherein an area of the plural first openings is 20 to 90% of an area ofthe first extending portion, and an area of the plural second openingsis 20 to 90% of an area of the second extending portion.
 10. Themultilayer electronic component of claim 8, wherein the Si organiccompound layer includes alkoxy silane.
 11. The multilayer electroniccomponent of claim 10, wherein Tb/Ta is 0.5 or more and 0.9 or less,where a thickness of the first conductive resin layer on the first bandportion of the first electrode layer is defined as ‘Ta’ and a thicknessof the first extending portion is defined as ‘Tb’.
 12. The multilayerelectronic component of claim 8, wherein the first and second conductiveresin layers include a conductive metal and a base resin.
 13. Themultilayer electronic component of claim 8, wherein the first and secondelectrode layers include a conductive metal and glass.
 14. Themultilayer electronic component of claim 8, further comprising: firstand second additional plating layers disposed on the first and secondplating layers, respectively.